发明名称 Electric component having an electronic component device located on a face of a package member with a space therebetween
摘要 <p>The invention provides an electronic component, comprising: a package member; a via hole electrode provided through the package member and protruding from a first face of said package member; an electronic component device located on the first face of said package member with a space therebetween; the space between the electronic component device and the first face of said package member being determined by a protruding amount of the via hole electrode from the face of said package member; and a joining member joining the electronic component device with the via hole electrode. In the electronic component, the space between the package member and the face of said package member can be readily and accurately obtained.</p>
申请公布号 EP0889585(B1) 申请公布日期 2007.08.29
申请号 EP19980111217 申请日期 1998.06.18
申请人 MURATA MANUFACTURING CO., LTD. 发明人 ISHINO, SATOSHI;KUBOTA, KENJI;SAITO, TSUYOSHI;MAESAKA, MICHINOBU;OGAWA, MAMORU;INOUE, JIRO;KAIDA, HIROAKI
分类号 H01L23/12;H03H9/10;H03H9/02;H03H9/17 主分类号 H01L23/12
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