| 发明名称 |
ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce an intermetallic compound having a large ratio of Au. <P>SOLUTION: The electronic part 100 is provided with an electric terminal 103 of which the uppermost surface of a metal terminal is plated with gold and an aluminum wire 104 which are electrically connected with each other by wire bonding. The gold plating is formed by applying electroless Au-plating. An intermetallic compound which is produced by joining the gold plating and the aluminum wire 104 is AuAl or AuAl and AuAl<SB>2</SB>. The electroless gold plating is gold plating of purity of 99.99% or more. <P>COPYRIGHT: (C)2007,JPO&INPIT |
| 申请公布号 |
JP2007103428(A) |
申请公布日期 |
2007.04.19 |
| 申请号 |
JP20050287801 |
申请日期 |
2005.09.30 |
| 申请人 |
FUJI ELECTRIC DEVICE TECHNOLOGY CO LTD |
发明人 |
KAMIYANAGI KATSUMICHI;ASHINO KIMIYASU |
| 分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
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