| 摘要 |
Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, to reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2 b formed in one dielectric substrate 1 b, and the other dielectric substrate 1 a having the waveguide terminal 2 a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.
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