| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing occurrence of breakage while equalizing stress occurring in each conductive protruding electrode, which connects electrodes with each other connecting packages with each other, even if the packages have warpage when laminating the semiconductor packages. SOLUTION: The semiconductor device is composed by laminating two semiconductor packages 1, 11, which are respectively composed by arranging each of semiconductor elements 3, 13 on each surface of wiring boards 2, 12, via the conductive protruding electrodes 15 respectively arranged between first/second connection electrodes 5, 14 respectively plurally provided to the opposite faces of both wiring boards. A joint area with the conductive protruding electrode 15 in each first connection electrode 5 is respectively formed identically with each other. A joint area with the conductive protruding electrode 15 in each second connection electrode 14 is respectively formed identically with each other. The joint area of the first connection electrode 5 is formed larger than that of the second connection electrode 14. COPYRIGHT: (C)2007,JPO&INPIT
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