| 摘要 |
Ashing equipment for fabricating a semiconductor device is provided to reduce or minimize a setting error of an orifice due to an orifice gap, by integrally forming the orifice with a tube. Ashing equipment for eliminating a photoresist on a wafer by using microwave plasma includes a tube(104) transferring the microwave plasma to an ashing chamber, and an orifice(100) formed on a lower portion of the tube for controlling an amount of the microwave plasma flowing in the tube. The orifice is made of the same material as that of the tube. The orifice is made of sapphire.
|
