| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which, in ultrasonic flip chip packaging, spreading of fracture of the electrode of a semiconductor element under ultrasonic oscillation is suppressed, giving no damage on the base material (interlayer film) of the electrode of the semiconductor element. SOLUTION: The ultrasonic flip-chip packaging is performed using a semiconductor element 6 in which a hole 9 is formed on the side perpendicular to the ultrasonic oscillation direction in the edge of a joint surface with a bump electrode 3 of an electrode 7. COPYRIGHT: (C)2007,JPO&INPIT |
