发明名称 COMPOSITION FOR INSULATION MATERIAL FORMATION AND INSULATION FILM
摘要 PROBLEM TO BE SOLVED: To provide a compound capable of forming an insulation material having a low dielectric constant; to provide a composition for insulation material formation containing the compound; and to provide an insulation material obtained from the composition. SOLUTION: This compound is represented by general formula (1). This composition for insulation material formation is characterized by containing its hydrolysate and/or condensate. In general formula (1), R<SB>1</SB>-R<SB>8</SB>are each a hydrogen atom, an alkyl group, an aryl group, an alkoxy group or a silyloxy group independently of one another. At least one of the groups represented by R<SB>1</SB>-R<SB>8</SB>is an alkyl group, an aryl group, an alkoxy group or a silyloxy group each having a group represented by general formula (S1) as a substituted group. In the general formula (S1), X is a hydrolizable group; R<SB>9</SB>is an alkyl group, an aryl group or a heterocycle group; and n is an integer of 1 to 3. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006269402(A) 申请公布日期 2006.10.05
申请号 JP20050276397 申请日期 2005.09.22
申请人 FUJI PHOTO FILM CO LTD 发明人 WARIISHI KOJI
分类号 H01B3/46;C07F7/21;C08G77/04;C08G77/06;H01L21/312;H01L21/316 主分类号 H01B3/46
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