发明名称 |
Semiconductor device with surface-mountable outer contacts, and process for producing it |
摘要 |
A semiconductor device with surface-mountable outer contacts and to a process for producing it is disclosed. In one embodiment, surface-mountable outer contacts are arranged on outer contact connection surfaces on the underside of the semiconductor device. In their respective center region, the outer contact connection surfaces have at least one recess which has a dovetail-like profile, the areal extent of the recess being smaller than the maximum cross section of an outer contact. In a one process, the recess in the center region is achieved by selective deposition of correspondingly patterned metal layers.
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申请公布号 |
US2006192298(A1) |
申请公布日期 |
2006.08.31 |
申请号 |
US20060348638 |
申请日期 |
2006.02.07 |
申请人 |
BAUER MICHAEL;ESCHER-POEPPEL IRMGARD;FUERGUT EDWARD;JEREBIC SIMON;WOERNER HOLGER |
发明人 |
BAUER MICHAEL;ESCHER-POEPPEL IRMGARD;FUERGUT EDWARD;JEREBIC SIMON;WOERNER HOLGER |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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