| 摘要 |
PURPOSE:To lessen the manufacturing cost by forming a strain buffer film consisting of a glassivation film and a photoresist at the front of a bonding pad including its peripheral part. CONSTITUTION:A bonding pad 3 is formed through an insulating film 2 of an oxide silicon film and the like on a semiconductor substrate 1 where elements are formed. A strain buffer film consisting of a glassivation film 4 and photoresist 5 is formed over the whole surface with the exception of a part where a bonding wire 6 of the bonding pad 3 is connected. And resin sealing is carried out in this state of the surface. A mask which is used in the case where the glassivation film 4 is formed over the whole surface and an opening is formed on the bonding pad can be used by the photoresist film 5 as it is and it may be as well to have the photoresist film 5 which is thicker than the conventional polyimide film. As the photoresist layer which is used for patterning of the glassivation film is used as the strain buffer film, this causes the photolithography process to decrease.
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