| 摘要 |
<p>PURPOSE:To decrease load reflection noise and to suppress increase of a delay by providing a layer for wiring between signal pins of an end LSI and termination resistance of a serial metal wiring. CONSTITUTION:Signals coming from a solder bump 8a of an LSI 3 is led to a pad 9 for examination and repair on the upper surface of a module substrate 1, and they enters a wiring layer by a through hole 10a. They are connected to a through hole 10b by a signal wiring 6a, and connected to a colder bump 8b of the adjacent LSI. A termination resistance wiring 11a of this wiring is provided in a termination resistance-only layer 12 different from a usual wiring layer of a signal wiring 6, and is connected to a termination resistance 7a by a through hole 13a for use only in termination resistance pins. The length of the through hole 13a is 1/3 the length of general through holes 10a and 10b, and this structure enables the capacity of through holes to be small, decreasing reflection noise.</p> |
