发明名称 SUBSTRATE FOR MOUNTING ELECTRONIC PARTS
摘要 <p>PURPOSE:To arrange the constitution such that circuit design is easy and further it is excellent in connection reliability even without executing resin sealing and heat radiation effect can also obtained sufficiently by bonding, with a wire, a conductor circuit formed on a base material and an internal connection part through a hole reaching the internal connection part of a lead. CONSTITUTION:A base material 4 consisting of material such as resin, etc., is provided in a body on both sides of the internal connection part 3 of each metallic material 7 which is constituted by uniting a lead 2 and an internal connection part 3, and a conductor circuit 6 is formed on at least one side of the base material 4. The conductor circuit 6 and the lead 2 are electrically connected with each other by bonding a wire 9 through a hole 5 which is provided in the base material 4 and reaching the internal connection part 3 of the lead 2. Hereby, circuit design becomes easy, and resin sealing at the connection part between the conductor circuit of a substrate 4 to mount electronic parts and each lead need not necessarily be executed, and it becomes excellent in connection reliability and it can provide head radiation structure easily.</p>
申请公布号 JPH01286337(A) 申请公布日期 1989.11.17
申请号 JP19880115161 申请日期 1988.05.12
申请人 IBIDEN CO LTD 发明人 KOSAKA KATSUMI;HIROI ATSUSHI;KONDO MITSUHIRO;TAKEYAMA TAKESHI
分类号 H01L23/12;H01L23/50;H05K3/20;H05K3/32;H05K3/40;H05K3/42 主分类号 H01L23/12
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