METHOD OF CONNECTING DEVICE ON INTEGRATED CIRCUIT SUBSTRATE TO METALLIZED LAYER,申请号JP19890022726-传众专利搜索

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发明名称	METHOD OF CONNECTING DEVICE ON INTEGRATED CIRCUIT SUBSTRATE TO METALLIZED LAYER
摘要
申请公布号	JPH025412(A)	申请公布日期	1990.01.10
申请号	JP19890022726	申请日期	1989.02.02
申请人	NATL SEMICONDUCTOR CORP <NS>	发明人	BIBETSUKU DEI KURUKARUNI
分类号	H01L21/28;H01L21/768	主分类号	H01L21/28
代理机构		代理人
主权项
地址

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