发明名称 WIRING BOARD
摘要 PURPOSE:To exclude crosstalk noise and to improve heat dissipation properties by providing a metal plate having a hole whose diameter is larger than that of a through-hole to a position whereto front and rear conductor circuits are connected and an insulating coating electric wire provided to an inside of a groove. CONSTITUTION:A metal plate 1 is provided which has a groove 2 formed to a shape of a necessary wiring pattern and has a hole whose diameter is larger than that of a through-hole 7 in a position whereto front and rear two conductor circuits are connected. An insulating coating electric wire 3 is provided to an inside of the groove 2. A conductor pattern 6 is provided in opposition to the groove 2 of the metal plate 1, and insulating resin 9 is provided between a part of the through hole 7 and the metal plate 1. First, the groove 2 filled with a wire is provided to a surface of the metal plate 1, a hole is shaped and an interior thereof is filled with resin. Adhesive is applied onto the metal plate 1, an insulating wire is provided to the groove part, a copper foil is laminated, unnecessary copper foil is etched and removed, a through-hole is shaped, and an inside of the hole is metallized by plating.
申请公布号 JPH04314379(A) 申请公布日期 1992.11.05
申请号 JP19910079948 申请日期 1991.04.12
申请人 HITACHI CHEM CO LTD 发明人 MASUDA YOSHIHISA;MINAMI NOBUYUKI
分类号 H05K1/05;H05K3/46;H05K7/20 主分类号 H05K1/05
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