| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a memory heat-dissipating structure being capable of dissipating the heat of a memory module and not shortening the distance between the left-right sides of the adjacent memory modules. <P>SOLUTION: The memory heat-dissipating structure is composed of two or more of memory elements, a radiator 20 and a plurality of screw elements 30. Each memory element includes two mutually assembled heat-dissipating sheets and a memory module 12 held between the two sheets. Screw holes are formed to the heat-dissipating sheets for each memory element, and the radiator contains base sections, heat-dissipating column bodies extended from a plurality of the base sections and long tanks penetrating a plurality of the base sections. The screw holes corresponding to each memory element are formed to each long tank, and the upper end faces of the heat-dissipating sheets for each memory element are brought into contact with the bottom end faces of the base sections of the radiator. The screw elements penetrate the long tanks for the radiator respectively, and screwed to the screwing holes for the corresponding memory elements and fixed to the radiator. According to the structure, the heat dissipation of the memory modules are achieved. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
