| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate film for dicing which leaves little cut chips in a dicing process of a semiconductor wafer, more rapidly and easily recover used dicing films in a rack and prevent blocking, and to provide a dicing film. SOLUTION: The substrate film for dicing is formed by laminating an A-layer, a B-layer and a C-layer, wherein the A- and C-layers each contain a vinyl aromatic hydrocarbon-conjugate diene hydrocarbon copolymer hydrogen additive of 50-10 wt.%, and an ethylene-(meta) acrylic acid copolymer of 50-90 wt.%, and the B-layer contains a vinyl aromatic hydrocarbon-conjugate diene hydrocarbon copolymer hydrogen additive of 90-30 wt.%, and an ethylene-(meta) acrylic acid copolymer of 10-70 wt.%. COPYRIGHT: (C)2009,JPO&INPIT
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