发明名称 SHAPE MEMORY THERMAL CONDUCTION SWITCH
摘要 A thermal conduction switch includes a thermally-conductive first member having a first thermal contacting structure for securing the first member as a stationary member to a thermally regulated body or a body requiring thermal regulation. A movable thermally-conductive second member has a second thermal contacting surface. A thermally conductive coupler is interposed between the first member and the second member for thermally coupling the first member to the second member. At least one control spring is coupled between the first member and the second member. The control spring includes a NiTiFe comprising shape memory (SM) material that provides a phase change temperature <273 K, a transformation range <40 K, and a hysteresis of <10 K. A bias spring is between the first member and the second member. At the phase change the switch provides a distance change (displacement) between first and second member by at least 1 mm, such as 2 to 4 mm.
申请公布号 US2009184798(A1) 申请公布日期 2009.07.23
申请号 US20080330350 申请日期 2008.12.08
申请人 UNIVERSITY OF CENTRAL FLORIDA RESEARCH FOUNDATION, 发明人 VAIDYANATHAN RAJAN;KRISHNAN VINU;NOTARDONATO WILLIAM U.
分类号 H01H37/00 主分类号 H01H37/00
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