发明名称 SEMICONDUCTOR DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To overcome the problem that wiring congestion is caused if a leakage current is reduced through potential control over a well substrate, when a connection portion from upper-layer wiring is disposed in a region where there are a number of wiring lines. <P>SOLUTION: A portion of a substrate power supply wiring line 120 is exposed by forming a power supply wiring line 110 in a U shape at a substrate power supply cell 100, and then a connection portion 140 to the upper-layer wiring line is disposed at the boundary portion of the substrate power supply cell 100, thereby reducing the leakage current without degrading signal wiring efficiency. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009164330(A) 申请公布日期 2009.07.23
申请号 JP20080000349 申请日期 2008.01.07
申请人 PANASONIC CORP 发明人 KISHISHITA KEISUKE
分类号 H01L21/82 主分类号 H01L21/82
代理机构 代理人
主权项
地址