SINGLE WAFER ETCHING APPARATUS

摘要

A single wafer etching apparatus is an apparatus that supplies etching liquid to an upper face of a thin discoid wafer obtained by slicing a semiconductor ingot while rotating the wafer to etch the upper face and an edge face of the wafer. The apparatus includes: a first nozzle for supplying etching liquid to the upper face of the wafer; and a second nozzle for supplying etching liquid to the edge face of the wafer that is opposed to the edge face of the wafer. The second nozzle is fixed at a predetermined position in a range of -10 mm to 20 mm from an end of an outer periphery of the wafer toward an inner side of the wafer in the radial direction. The apparatus includes a lower face blowing mechanism by which etching liquid flowing along the edge face of the wafer is blown off by gas jet toward an outer side in the radial direction of the wafer.