| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly heat resistant and flame retardant adhesive resin composition containing practically no halogen atom, and especially suitable for a flexible printed circuit board. SOLUTION: The flame retardant adhesive resin composition contains (i) an epoxy resin, (ii) a curing agent, (iii) a curing accelerator, and (iv) a carboxyl group-containing phenoxy resin represented by general formula (1) as essential components, and does not practically contain any halogen atom, wherein, X is a bi-valent group such as e.g. a phenylene group or naphthylene group etc., Z is a hydrogen atom or glycidyl group, and A is a carboxyl group-containing organic group. The sum of n and m is at least 21, and n is a number larger than 0. COPYRIGHT: (C)2009,JPO&INPIT |
