| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, which can obtain high reliability by making no bubble remain when forming a resin sealed part. SOLUTION: The method includes: a sealing step of forming a resin sealing part by clamping a collective substrate 71 in which a light-emitting element 31, a light-receiving element 32, and a control IC 33 are mounted at prescribed positions respectively with a lower mold 110 provided with a cavity 111 and an upper mold facing the lower mold 110, and by filling a molten resin in the cavity 111 to cure it; and an individual piece making step of forming individual package parts by removing the surplus region of the resin sealing part, and of making individual pieces by dividing the collective substrate 71 for each unit substrate. The sealing step forms the resin sealing part in the cavity 111 by the lower mold 110 in which a projecting part 111b for narrowing a space between the control IC and the lower mold is provided at the location where the surplus region of the resin sealing part is formed and the control IC 33 is mounted. COPYRIGHT: (C)2009,JPO&INPIT
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