发明名称 |
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE |
摘要 |
The present invention provides an adhesive composition which comprises (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally comprises (d) a filler and/or (e) a curing accelerator; a process for producing an adhesive composition, comprising: mixing (a) the epoxy resin and (b) the curing agent with (d) the fillers followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film comprising the above-mentioned adhesive composition formed into a film; a substrate for mounting semiconductor comprising a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which comprises the above-mentioned adhesive film or the substrate for mounting semiconductor.
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申请公布号 |
US2009186955(A1) |
申请公布日期 |
2009.07.23 |
申请号 |
US20090414420 |
申请日期 |
2009.03.30 |
申请人 |
INADA TEIICHI;SUMIYA KEIJI;TOMIYAMA TAKEO;IWAKURA TETSUROU;KAWAKAMI HIROYUKI;SUZUKI MASAO;MATSUZAKI TAKAYUKI;HOSOKAWA YOUICHI;HATAKEYAMA KEIICHI;SHIMADA YASUSHI;TANAKA YUUKO;KURIYA HIROYUKI |
发明人 |
INADA TEIICHI;SUMIYA KEIJI;TOMIYAMA TAKEO;IWAKURA TETSUROU;KAWAKAMI HIROYUKI;SUZUKI MASAO;MATSUZAKI TAKAYUKI;HOSOKAWA YOUICHI;HATAKEYAMA KEIICHI;SHIMADA YASUSHI;TANAKA YUUKO;KURIYA HIROYUKI |
分类号 |
C08L63/00;C08G59/18;C08J9/00;C09J163/00;H01L23/14;H01L23/29;H01L23/31 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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