| 摘要 |
<P>PROBLEM TO BE SOLVED: To highly accurately and easily polishing only a peripheral part of a wafer. <P>SOLUTION: An outer peripheral border 35a of a member 35 to be polished is cut by a bite 29 fixed to a table base 25, and the member 35 to be polished is formed in a perfect circle and positioned at a Y-directional-reference position of the table base 25. Next, a halting state of the table base 25 is held, a polishing unit 30 is once raised, the table base 25 is horizontally moved in a column 16 direction, and the Y-direction of the member 35 to be polished is positioned at the position for polishing only a peripheral border part 3 of the wafer 1. A horizontal-movement-distance F at that time is found from a correlated position in the Y-direction between the bite 29 and the wafer 1 on a chuck table 20, and a width of the peripheral border part 3 to be polished. After this, lowering the polishing unit 30 causes an outer circumference part of the lower surface of the member 35 to be polished to polish the peripheral border part 3. <P>COPYRIGHT: (C)2009,JPO&INPIT |
