发明名称 High directivity ultra-compact coupler
摘要 A coupler includes a substrate and a stack of first and second dielectric layers extending over a top surface of the substrate. The first dielectric layer comprises different dielectric material than the second dielectric layer. Two conductive lines extend over the stack of first and second dielectric layers, and are formed in the same plane parallel to a surface of the substrate.
申请公布号 US7564325(B2) 申请公布日期 2009.07.21
申请号 US20070675564 申请日期 2007.02.15
申请人 FAIRCHILED SEMICONDUCTOR CORPORATION 发明人 HUSSAIN ABID;DONOGHUE DANIEL J.;GRAY ERIC S.
分类号 H01P5/18;H01P3/08 主分类号 H01P5/18
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