| 摘要 |
A wafer alignment apparatus is provided to prevent a defect in a specific part by coinciding with the centering of up, down, right, and left parts of a wafer. A main sensor(200) is installed in a nozzle unit(100) positioned in an upper part of a wafer(10). The main sensor performs the centering by conforming the center of the nozzle unit with the center of the wafer when the wafer transferred by a robot arm is received in the upper part of a vacuum chuck(20). A controller(300) receives the signal sensed in the main sensor and controls the nozzle unit by operating the signal. The main sensor a first photo sensor(210) and a second photo sensor(220). The first photo sensor irradiates the light downward. The second photo sensor is installed in a position separated from the lower part of the first photo sensor and senses the light irradiated in the first photo sensor.
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