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发明名称
在表面上制作微小导电结构的方法
摘要
本发明系藉由(热)转印及/或压印奈米等级凹槽于基材上,再由毛细作用之辅助于凹槽中导入导电性物质,最后再经由适当之导电物质后处理而制作微小导电结构的方法。
申请公布号
TW200924576
申请公布日期
2009.06.01
申请号
TW097127233
申请日期
2008.07.18
申请人
拜耳材料科学股份有限公司
发明人
史帝芬;艾迪恩;梅麦可;韩瑞克;巫理奇
分类号
H05K3/14(2006.01)
主分类号
H05K3/14(2006.01)
代理机构
代理人
林秋琴;何爱文
主权项
地址
德国
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