发明名称 |
INTERPOSER ASSEMBLY AND A METHOD OF FORMING AND LOADING METAL SPRING CONTACTS IN AN INSULATING PLATE |
摘要 |
<p>An interposer assembly includes a dielectric plate having a plurality of contact passages extending through the plate with a contact in each passage. Each contact is formed from a length of cylindrical preplated metal wire having a small diameter. Interposer assemblies with contacts formed from small diameter wire contacts have reduced contact inductance and permit reduction of the thickness of the dielectric plate and of the spacing between adjacent contacts on the plate.</p> |
申请公布号 |
HK1098255(A1) |
申请公布日期 |
2009.05.29 |
申请号 |
HK20070104334 |
申请日期 |
2007.04.24 |
申请人 |
AMPHENOL CORPORATION |
发明人 |
NEIDICH, DOUGLAS, A. |
分类号 |
H01R;H01R12/04;H01R12/16;H01R13/03;H01R13/24;H01R43/20 |
主分类号 |
H01R |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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