发明名称 POWER SEMICONDUCTOR MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide a power semiconductor module that does not significantly increase man-hour of manufacturing process with respect to the power semiconductor module connected to an external printed circuit board by a repulsive force generated by metal spring compression. <P>SOLUTION: The power semiconductor module includes a power semiconductor element, a case for accommodating the power semiconductor element, a control terminal which is connected to a control electrode of the power semiconductor element and which is protruded from an upper surface of the case, and a conductive spring whose inner surface is not only inserted so as to be in contact with at least part of a side surface of the control terminal but also in press-contact with the printed circuit board opposite to the upper surface of the case to make electric connection thereto. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009081399(A) 申请公布日期 2009.04.16
申请号 JP20070251418 申请日期 2007.09.27
申请人 MITSUBISHI ELECTRIC CORP 发明人 YAMADA JUNJI
分类号 H01L25/07;H01L25/18 主分类号 H01L25/07
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