摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power semiconductor module that does not significantly increase man-hour of manufacturing process with respect to the power semiconductor module connected to an external printed circuit board by a repulsive force generated by metal spring compression. <P>SOLUTION: The power semiconductor module includes a power semiconductor element, a case for accommodating the power semiconductor element, a control terminal which is connected to a control electrode of the power semiconductor element and which is protruded from an upper surface of the case, and a conductive spring whose inner surface is not only inserted so as to be in contact with at least part of a side surface of the control terminal but also in press-contact with the printed circuit board opposite to the upper surface of the case to make electric connection thereto. <P>COPYRIGHT: (C)2009,JPO&INPIT |