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发明名称
基板薄型化装置,基板薄型化方法以及基板薄型化组件
摘要
提供基板薄型化装置以及方法。装置包括:可容纳待蚀刻之基板的腔室;在腔室中彼此间隔开之蚀刻剂入口与蚀刻剂出口;以及与蚀刻剂入口以及蚀刻剂出口连通之蚀刻剂储存槽,其中待蚀刻之基板经浸渍于供应至腔室之蚀刻剂中且由蚀刻剂来蚀刻。
申请公布号
TW200916423
申请公布日期
2009.04.16
申请号
TW096141584
申请日期
2007.11.02
申请人
宇进先行技术股份有限公司
发明人
李承郁;李义玉
分类号
C03C15/00(2006.01);H01L21/302(2006.01)
主分类号
C03C15/00(2006.01)
代理机构
代理人
詹铭文;萧锡清
主权项
地址
南韩
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