| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent a solder from adhering to the tip of a positioning pin and a hook of an electronic component without applying a significant change to a manufacturing process of the electronic component while utilizing an existing flow soldering apparatus as it is. <P>SOLUTION: An electronic component has a metal terminal subjected to flow soldering through a through hole of a printed board and a resin part having a pin or a hook protruding from the through hole of the printed board in the same direction as the terminal. In the electronic component, there is provided a pin cut-off part or a hook cut-off part with less filling density of resin at the tip of the pin or the hook after resin molding, whereby it is made possible to eliminate a region with low resin filling density. There is therefore no possibility of producing any irregularity on the tips of the positioning pin and the hook even at a high temperature upon flow soldering, preventing adhering of a solder. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
