发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE DRY FILM BY THE USE THEREOF
摘要 <p>A photosensitive resin composition and a photosensitive dry film which are excellent in both sensitivity and stability and are well-balanced in tent strength, resolution and plating non-staining are provided. The photosensitive resin composition comprises an alkali-soluble resin (A), a photopolymerizable compound (B) and a photopolymerization initiator (C), and the polymerization initiator (C) comprises a hexaarylbisimidazole based compound (C1) and a multifunctional thiol compound (C2) as essential components. The photosensitive dry film has at least a photosensitive resin layer formed from the photosensitive resin composition on a support film.</p>
申请公布号 EP1825328(B1) 申请公布日期 2009.04.15
申请号 EP20050811384 申请日期 2005.11.22
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 UEMATSU, TERUHIRO;KATSUMATA, NAOYA
分类号 G03F7/031 主分类号 G03F7/031
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