发明名称 ROHR-BONDER
摘要 The present invention has a purpose of providing a tube connecting apparatus capable of stably, accurately executing control of wafer temperature even when connecting of tubes is conducted continuously. A tube connecting apparatus ( 1 ) includes a heater ( 70 ) for heating a wafer holder ( 5 a), a thermister ( 71 ) which detects the temperature of the wafer holder ( 5 a), a heater heating control device ( 69 ) which controls the heater ( 70 ) based on output of the thermister ( 71 ), and a wafer heating control device ( 68 ) which performs heating control of a wafer ( 6 ) through constant power control. Before the start of heating the wafer ( 6 ) by the wafer heating control device ( 68 ), the control of the heater ( 70 ) is performed by the heater heating control device ( 69 ) for temperature control so that the wafer holder ( 5 a) is heated to a fixed temperature (about 65° C.).
申请公布号 AT427209(T) 申请公布日期 2009.04.15
申请号 AT20030809847T 申请日期 2003.09.17
申请人 TERUMO KABUSHIKI KAISHA 发明人 SANO, HIROAKI;NAGASHIMADA, MASARU;ISHIDA, SHINJI
分类号 A61M1/28;B29C65/74;G01R29/08;A61M1/14;A61M39/14;B29C65/00;B29C65/02;B29C65/20;B29L23/00;G06F17/50 主分类号 A61M1/28
代理机构 代理人
主权项
地址