发明名称 SURFACE-MOUNTING PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a surface-mounting package preventing damage in a bonding portion between a lead terminal and an insulator by structurally increasing a drag force against a moment, improving the fixing strength between the lead terminals and the insulator and correctly positioning the lead terminals. SOLUTION: The package has a structure in which a package body 10 has a through hole 16, one side portion 18a of an L-shaped lead terminal 18 is inserted into the through hole 16, the other side portion 18b of the lead terminal 18 is exposed from the package body 10, the one side portion 18a of the lead terminal 18 is fixed in the through hole 16 by an insulator 20 filled in the through hole 16, and one part of the insulator 20 is exposed outside the through hole 20 and extends to the vicinity of a bent corner portion 18d of the lead terminal 18. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009076700(A) 申请公布日期 2009.04.09
申请号 JP20070244578 申请日期 2007.09.21
申请人 PANASONIC CORP 发明人 SAKAMOTO SUKEYUKI
分类号 H01L23/04;H01R33/05;H03H9/02 主分类号 H01L23/04
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