| 摘要 |
PROBLEM TO BE SOLVED: To solve problems of a surface-mounted electronic component which occur when the surface-mounted electronic component is soldered at the time of surface-mounting, such as the generation of a solder crack and the peeling of a pattern in an extended period of use in an environment frequently subjected to vibration or impacts due to the weak bonding strength of a soldering portion composed of a solder ball and a ball formation land. SOLUTION: Problems such as a solder crack, reduction in cooling power, and deterioration in electric characteristics are suppressed by chamfering corners of a heat-conductive sheet in order to reduce the relative displacement of a heatsink and a surface-mounted electronic component caused by stress generated by vibration or impacts and by thermal expansion and thermal contraction. COPYRIGHT: (C)2009,JPO&INPIT
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