发明名称 HEAT SINK APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a heat sink apparatus which can be machined easily and has high cooling capability. SOLUTION: The heat sink apparatus includes base plates 4 each having a heater 1 joined thereto and a cooling medium channel 10 through which a cooling medium flows, and plate members 20 each of which is inserted in the cooling medium channel, erected along the direction of thickness of the base plate, oriented to cross the main flow direction 31 of the cooling medium in the cooling medium channel, and has openings 21 through which the cooling medium can pass. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010278286(A) 申请公布日期 2010.12.09
申请号 JP20090130108 申请日期 2009.05.29
申请人 MITSUBISHI ELECTRIC CORP 发明人 CHIBA HIROSHI;ISHIKAWA HIROAKI;ISHIBASHI SEIJI;MAEKAWA HIROTOSHI;NAKAJIMA KOJI;MATSUO HARUYUKI
分类号 H01L23/467;H01L23/36;H01L23/473;H05K7/20 主分类号 H01L23/467
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