| 摘要 |
A hot melt structure for an electronic device is disclosed. The electronic device comprises a first component and a second component. The hot melt structure comprises a fixing element and a hot melt element. The fixing element is disposed on the first component, and the hot melt element is disposed on the second component. The hot melt element comprises a gap portion and a hollow portion through which the fixing element is combined with the hot melt element. The height of the hot melt element is larger than that of the fixing element. The hot melt element can be heated to deform inwardly towards the hollow portion for fixing the fixing element.
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