发明名称 LIGHT EMITTING DIODE PACKAGE
摘要 <p>PURPOSE: A light emitting diode package is provided to improve the luminosity of an LED chip by forming a wavelength converting part which converts the wavelength band of light which emanates from the LED chip. CONSTITUTION: A light emitting diode chip(112) is formed inside a light emitting diode main body(110). An inner sealing part(120) seals the light emitting diode chip. A plurality of grooves(122) are formed on the surface of the inner sealing part. A wavelength converting part(130) converts the wavelength band of light which emanated from the light emitting diode chip. An outer sealing part(140) is formed in order to cover the wavelength converting part.</p>
申请公布号 KR20100128574(A) 申请公布日期 2010.12.08
申请号 KR20090047044 申请日期 2009.05.28
申请人 SAMSUNG LED CO., LTD. 发明人 KIM, JAE IL;HAM, SUK JIN;CHO, DONG HYUN;LEE, IN HYUNG
分类号 H01L33/50 主分类号 H01L33/50
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