| 摘要 |
PURPOSE: A printed circuit board is provided to prevent the delamination of a layer due to stress by forming a stress absorption hole in the vicinity of a lead insertion hole. CONSTITUTION: A printed circuit board comprises a land(120), a lead insertion hole(110), and a stress absorption hole(130). A solder is soldered on the land. The lead insertion hole passes through the land. The stress absorption hole is formed in the vicinity of the lead insertion hole in order to absorb stress which is transferred from the lead insertion hole. The stress absorption hole is formed into a rectangular shape. A plurality of secondary lands are formed in vicinity of the land.
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