A VIA PASTE COMPOSITION

摘要

PURPOSE: A via paste composition is provided to offer a thermosetting paste for forming a heat conductive via with the excellent thermal conductivity. CONSTITUTION: A via paste composition is formed with a thermo-conductive material and a thermosetting resin. The thermo-conductive material contains silver powder with the average particle diameter of 100~300 nanometers, and silver-coated copper powder with the average particle diameter of 3~10 microns. The thermosetting resin contains an epoxy resin including either phenol novolak based epoxy or cresol novolak based epoxy.