| 摘要 |
<p>PURPOSE: An electrostatic chuck is provided to perform a contact thermal conductive heating of an absorbed wafer. CONSTITUTION: An electrostatic chuck includes a dielectric layer and a support layer. A wafer is arranged on the surface of the dielectric layer made of aluminum nitride. The support layer is contacted with the rear of the dielectric layer and is made of aluminum nitride sintered element including Sm and Ce.</p> |
