发明名称 |
Substrate, substrate fabrication, semiconductor device, and semiconductor device fabrication |
摘要 |
A substrate for fixing an integrated circuit (IC) element comprises: a substrate for fixing an integrated circuit element includes: a plurality of metal posts that are aligned in a longitudinal direction and a lateral direction in plan view, each of the plurality of metal posts having a first surface and a second surface facing an opposite direction to the first surface, the plurality of metal posts being configured identically; and a joining section that joins each of the plurality of metal posts together at a portion of each of the plurality of metal posts between the first surface and the second surface.
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申请公布号 |
US7807498(B2) |
申请公布日期 |
2010.10.05 |
申请号 |
US20080170943 |
申请日期 |
2008.07.10 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
SHOJI MASANOBU;FUJITA TORU |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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