发明名称 |
Die stacking apparatus and method |
摘要 |
Various stacked semiconductor devices and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a first semiconductor die that has a first bulk semiconductor side and a first opposite side. A second semiconductor die is provided that has a second bulk semiconductor side and a second opposite side. The second opposite side of the second semiconductor die is coupled to the first opposite side of the first semiconductor die. Electrical connections are formed between the first semiconductor die and the second semiconductor die.
|
申请公布号 |
US7799608(B2) |
申请公布日期 |
2010.09.21 |
申请号 |
US20070832519 |
申请日期 |
2007.08.01 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
CHAN VINCENT;MCLELLAN NEIL;O'NEIL KEVIN |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|