| 摘要 |
PURPOSE: A surface processing method is provided to eliminate all the fractured layers formed on the surface of the member including the fractured layer of a stepped part by reforming the member surface. CONSTITUTION: A focus ring(25) is configured by a ring-shaped member having a step(25a) on the inner side. The step is formed in response to the outer side of a wafer. An upper side(25d), a lower side(25e), and sides(25g, 25f) of the focus ring are formed by the mechanical polishing. A horizontal part(25b) and a corner(25c) of the step are polished manually. |
