| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent reliability of a ceramic substrate from getting low caused by a defect in the periphery of a via, in the substrate. <P>SOLUTION: This ceramic substrate includes a ceramic laminate 100 laminated with a multilayered ceramic layers 10a, 10b, 10c, interlayer-connected through the via 30 provided in the respective ceramic layers 10a, 10b, 10c, and formed with a hole 40 for exposing an upper part of the via 30 in the surface ceramic layer 10a, a conductor 40a filled in the hole 40, and an external electrode 50 formed to be connected electrically to the conductor 40a on a surface of the ceramic laminate 100. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
