MEMS DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a MEMS (Micro Electro Mechanical Systems) device, capable of suppressing a voltage required for anodic bonding to a small level while an air escape is secured during the anodic bonding. SOLUTION: The manufacturing method of the MEMS device, comprising the processes of: process S1 for preparing an SOI substrate; process S2 for patterning a first silicon layer to a shape where the first silicon layer is divided into a plurality of basic patterns and all of them are connected by bridges to form the whole together; process S3 for removing a middle insulating layer by etching to connect a space at each of both sides of the bridges together; process S4 for bonding a base material and the SOI substrate; process S5 for applying voltage for anodic bonding; process S6 for patterning a second silicon layer to form an elevated silicon layer while exposing the bridges; and process S7 for forming a basic silicon layer from the first silicon layer using the elevated silicon layer as a mask while removing the bridges. COPYRIGHT: (C)2011,JPO&INPIT