发明名称 PRINTED CIRCUIT BOARD, AND METHOD FOR PRODUCING SAME
摘要 PROBLEM TO BE SOLVED: To provide a printed circuit board that has a heat radiator easily formed to enhance heat radiation efficiency.SOLUTION: The printed circuit board includes: a substrate unit 4 on which an electronic component 12 should be mounted, the substrate unit 4 including a plate-like insulating base 9 and a conductor pattern 10 formed at least on one surface of the insulating base 9 and connected to the electronic component 12 directly or indirectly through a lead wire 15; a metallic heat sink 2 overlaid on the other surface of the insulating base 9; and a heat transfer path thermally connecting the electronic component 12 and heat sink 2 to each other. The heat transfer path is a metallic pin 3 which is fixed in contact with the heat sink 2 and bonded to the electronic component 12.
申请公布号 JP2011199002(A) 申请公布日期 2011.10.06
申请号 JP20100064072 申请日期 2010.03.19
申请人 MEIKO:KK 发明人 TANE NORIAKI;TAKII HIDEYOSHI
分类号 H05K1/02;H01L23/12;H01L23/36;H01L23/40;H05K7/20 主分类号 H05K1/02
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