发明名称 |
PRINTED CIRCUIT BOARD, AND METHOD FOR PRODUCING SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board that has a heat radiator easily formed to enhance heat radiation efficiency.SOLUTION: The printed circuit board includes: a substrate unit 4 on which an electronic component 12 should be mounted, the substrate unit 4 including a plate-like insulating base 9 and a conductor pattern 10 formed at least on one surface of the insulating base 9 and connected to the electronic component 12 directly or indirectly through a lead wire 15; a metallic heat sink 2 overlaid on the other surface of the insulating base 9; and a heat transfer path thermally connecting the electronic component 12 and heat sink 2 to each other. The heat transfer path is a metallic pin 3 which is fixed in contact with the heat sink 2 and bonded to the electronic component 12. |
申请公布号 |
JP2011199002(A) |
申请公布日期 |
2011.10.06 |
申请号 |
JP20100064072 |
申请日期 |
2010.03.19 |
申请人 |
MEIKO:KK |
发明人 |
TANE NORIAKI;TAKII HIDEYOSHI |
分类号 |
H05K1/02;H01L23/12;H01L23/36;H01L23/40;H05K7/20 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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