| 摘要 |
<P>PROBLEM TO BE SOLVED: To propose a plate-type heat pipe module which is suitable for cooling a power semiconductor and is made compact, thin and lightweight. <P>SOLUTION: A rectangular metal plate is pressed to form a heat radiation plate 11. A flat bulged part 12 is formed on the heat radiation plate 11, so that a plurality of parallel routes 12a extending from one side end of the heat radiation plate 11 to the other side end thereof are communicated with one another at one side end thereof or both side ends. A vapor guiding plate having a planar shape one size smaller than that of the bulged part 12 is formed. A partition plate having almost the same planar shape as that of the heat radiation plate 11 is formed. The vapor guiding plate is housed in the concave space of the bulged part 12. Two resulting heat radiation plates 11 are joined to each other while interposing the partition plate between them, so that the back surfaces thereof are opposed to each other. As a result, passages of a working fluid can be formed in the concave spaces of two bulged parts 12 above and below the partition plate and one side of the joined heat radiation plates is used as a heat receiving part and the other thereof is used as a heat radiation part. <P>COPYRIGHT: (C)2012,JPO&INPIT |
