摘要 |
A thermal isolation arrangement for an LED lamp is disclosed. Embodiments of the invention provide thermal isolation between the power supply and the LED assembly (508) of an LED lamp, in most cases allowing the power supply to operate in a lower temperature range than would otherwise be possible. At least one contact feature (208, 212, 308) is provided between the power supply and the LED assembly (508) to maintain a thermal transfer gap (540, 542) between the power supply and the LED assembly (508). A contact feature can be, for example, a triangular ridge (208, 212) or a conical protrusion (308). In some embodiments, a thermal isolation device (200, 300) provides the contact feature or contact features (208, 212, 308). An LED lamp according to example embodiments of the invention can have a modular design and/or can include an Edison base (106) and/or an optical element (602, 608) or optical elements disposed to emit light from the LED lamp. |