LIGHT EMITTING DIODES PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A light emitting package and a manufacturing method thereof are provided to decrease a temperature of an encapsulating material by adding a wire forming an electrode to a lead frame. CONSTITUTION: A package mold(310) includes a cavity. A lead frame(320) is inserted into the package mold for being exposed to a bottom side of the cavity. A light emitting device chip(330) is mounted on the lead frame. A molding unit(350) absorbs the heat generated from the light emitting device chip.