| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve effects of improved performance and yield and reduced chip costs by improving dimensional accuracy of an electrically important portion. <P>SOLUTION: A technique for optimizing a semiconductor device manufacturing process forms a pattern based on circuit design data on a substrate through an exposure process using a photomask created from the circuit design data. The optimizing technique includes a step of weighting a difference based on electrical characteristic information extracted from the circuit design data in calculating a statistic based on distribution of the difference at plural predetermined portions between a pattern formed on the substrate by a first exposure device under a first exposure condition using the photomask and a pattern formed on the substrate by a second exposure device under a second exposure condition using the photomask; and a step (S27) of repeating the calculating while changing the second exposure conditions, and selecting an exposure condition that makes the total minimum or smaller than a predetermined reference value among different second exposure conditions, as an optimum exposure condition 21 for the second exposure device. <P>COPYRIGHT: (C)2012,JPO&INPIT |
