| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting method that prevents a solder protrusion affecting solder printability and a mounting failure when an electronic component with a thermal pad is mounted on a printed-circuit board for double-sided reflow. <P>SOLUTION: An electronic component mounting method mounts electronic components on a printed-circuit board having through holes that pass through from a surface for mounting an electronic component with a thermal pad to a surface with solder resists opposite to the mounting surface. The through hole is provided at a region where the thermal pad is soldered on the printed-circuit board. On the opposite side of the printed-circuit board, the solder resist is provided at a region except for the through hole and surrounding area, and a pattern member that absorbs solder is provided at a region where the solder resist is not provided. The electronic component is soldered on the mounting surface of the printed-circuit board via the thermal pad. <P>COPYRIGHT: (C)2013,JPO&INPIT |
